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Analysis of Contact Resistance and Temperature Rise of Spring Contact Finger Structure


Release time:

2022-03-15

As a special contact, the spring contact finger is connected between the pin and the socket. Through its structural transformation, multiple contact points are generated to form electrical interconnection. Each contact point acts as a "bridge" to make the current flow evenly. Due to its simple structure, small size and low cost, it is suitable for mass manufacturing and is widely used in medium and high voltage switches, bus connectors, high current connectors, fixed electrodes, high voltage cable end pieces, fuse connectors, and mechanical and electronic applications. Below we understand the contact resistance and temperature rise analysis of the lower spring contact finger structure.

Analysis of Contact Resistance and Temperature Rise of Spring Contact Finger Structure

Spring touch fingerAs a special contact, it is connected between the pin and the socket. Through its structural transformation, multiple contact points are generated to form electrical interconnection. Each contact point acts as a "bridge" to make the current flow evenly. Due to its simple structure, small size and low cost, it is suitable for mass manufacturing and is widely used in medium and high voltage switches, bus connectors, high current connectors, fixed electrodes, high voltage cable end pieces, fuse connectors, and mechanical and electronic applications. Below we understand the contact resistance and temperature rise analysis of the lower spring contact finger structure.

弹簧触指

Under the operation state of high-power interconnection deviceSpring touch fingerThe allowable temperature rise of the electrical equipment must meet the relevant technical requirements that the ambient air temperature is not higher than 40 ° under normal use environmental conditions. The contact resistance of the finger is mainly concentrated at the interface between the pin and the finger, and the spot overtemperature caused by Joule heat will be the allowable temperature rise of the spring contact finger. Therefore, the contact surface coupling method is used to establish a spring contact finger model to simulate the current contraction effect, and the contact resistance and contact temperature rise are obtained by thermoelectric coupling simulation. Then under the current conditions of 1, 1.5, 2 and 2.5 kA4 groups, the temperature field simulation calculation of the spring contact finger under AC and DC conditions is carried out, and the influence of resistance loss caused by AC skin effect on temperature rise is confirmed. The temperature rise of the contact finger structure is predicted by theoretical calculation, which mainly considers the heat generation rate of the contact part and the heat loss caused by conduction, convection and radiation.

The contact resistance is directly related to the heating rate of the contact, which is the root cause of the temperature rise of the contact and one of the important indicators to evaluate the reliability of the contact. It is generally composed of shrinkage resistance, thin film resistance and conductor resistance. In a specific use environment, the lower the contact resistance, the higher the contact reliability. Through the simulation of ANSYS finite element software, it is concluded that the shrinkage resistance can be reduced by appropriately increasing the positive contact pressure between the spring contact finger and the pin, improving the electroplating process and reducing the surface roughness of the material. Membrane resistance is usually produced by the contact surface film or other pollutants, long-term exposure to the harsh environment caused by the contact surface corrosion will also produce membrane resistance, especially the gold-plated parts have strong adsorption of hydrocarbons, production should try to avoid contact.

The temperature rise of the contact decreases with the increase of the contact area. The design of the V-groove structure of the socket with the spring contact finger can greatly increase the number of contacts and the contact area compared with the flat-bottom groove structure. At the same time, the equivalent contact resistance of the spring contact electrical connector decreases with the increase of the diameter of the spring alloy copper wire and the increase of the compression deformation, but when the compression deformation reaches a certain value, the contact resistance begins to saturate. Therefore, the contact resistance can be reduced by appropriately increasing the diameter of the spring alloy copper wire or appropriately increasing the mating interference between the spring contact finger and the pin, but it should be considered that the increase in the interference will cause the electrical connector when plugging. Wear, so choose the appropriate assembly interference. In addition, the contact resistance can also be reduced by appropriately increasing the number of spring clips.

nantong moore new material technology co., ltd. main products are watchband contact finger, spring contact finger, composite watchband contact finger, brass, copper wire, connector, spring contact, copper alloy spring and so on. Nantong Moore New Material Technology Co., Ltd. is developed from its predecessor Nantong Moore Electric Co., Ltd., which is an enterprise specializing in the design, development and research of high-strength and high-conductivity alloy materials and electrical connection products. Companies in the industry has achieved a high degree of recognition and reputation of the majority of customers. The company in line with professional advanced, pioneering spirit, set up rigorous and pragmatic, the basic concept. To do a product, cast a boutique for the purpose of the enterprise, and give full play to the characteristics of flexible and diverse enterprises, intentions to serve every customer.

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